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IR2153S Suppliers

0.18μm copper dual damascene process in space imaging (a)

In Electronic Infomation Category: 0 | on November 14,2010

1. AMD Saxony Manufacturing Co., Dresden D-01109, Germany; 2. AMD technology R & D Group, Sunnyvale, California; 3. KLA-Tencor, Migdal HaEmek 23100, Israel) Overview: Because of the space imaging overlay (Ovcrlay) technology budget With the integrated circuit (IC) design specifications of austerity and IR2153S datasheet and tight, therefore, Overlay accuracy measuring the importance of technology increases. After the development by (After Develop DI) stage and IR2153S price and after etching (After Etch FI) phase of the Overlay measurement results were compared to study design under 0.18μm copper dual damascene process in Owrlay accuracy. On the same wafer to ensure post-development (DI) stage and IR2153S suppliers and post-etch (FI) phase of the test conditions, we finished the 5 layers, the wafer were compared. In addition, use of CD-SEM...

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