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IC Electronic information

LED high-power low-cost ceramic heat LED packaging technology

In Electronic Infomation Category: L | on April 18,2011

Traditional LED packaging process is the LED chip (Chip) fixed (Bonding) in the heat above the substrate, through the wire (Wire Bonding) or Flip Chip (Flip Chip) means the line connection, and MC3403DR2G datasheet and then to dispensing, Molding (Molding), etc. to form coated LED chip LED die, and MC3403DR2G price and finally fixed on the circuit substrate grains (Circuit Board) above, and MC3403DR2G suppliers and integration of power (Power), Heatsink (Heat Sink), Lens (Lens) and reflector (reflector) to form a complete lighting module.


Figure 1: LED package diagram

Table 1: Comparison of various types of circuit boards


Turned around in the lighting module containing the circuit board substrate and the heat is most intense exposure to, so the heat source directly in contact with the ceramic substrates are used as the material, and when the power increasing, the trend of smaller and smaller components , the ceramic circuit substrate has gradually been widely used. Table 1 shows, the ceramic circuit board contained more than traditional circuit boards for LED lighting has the advantage, can be applied to high power (HP), high voltage (HV) and alternating current (AC) such as LED lighting, these LED are higher energy conversion rate or not the advantages of power converter, so the integration of the two LED lighting technology not only to improve stability, itll also reduce the overall total cost to make it easier to import for domestic lighting market.

But with the need for greater illumination of the small size of the increased demand for single-crystal package has not meet future needs, so the COB (Chip On Board) LED packaging technology was born along with the traditional chips and then be fixed on the substrate integrated circuit package substrate is different as shown in Figure 1, COB packaging single or multiple stars is directly encapsulated LED die containing the circuit board; the other by the heat that Ohms Theorem T = QR, temperature = heat flow x thermal resistance, thermal resistance greater, there is greater heat generated in the device, therefore COB packaging methods can avoid the use of package substrate to reduce the lighting module serial number of layers to enhance the thermal performance of LED. This technology can solve

single high-power heat generated by the package, it has a low thermal resistance, low assembly cost and high lumen output single package and other advantages, the present has been used extensively for lighting, but because of chip large amount of heat generated directly with the COB substrate contact, so when you need more illumination of the lighting module, the old aluminum (MCPCB) technology produced by the COB, will result in coefficient of thermal expansion mismatch problem of thermal tilt, so ceramic substrate technology with the introduction of imperative needs.

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